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TSEM 資訊
TSEM 事件
Tower Semiconductor and Semtech Expand Multi-Year Agreement
Tower Semiconductor (TSEM) and Semtech (SMTC) announced an expanded multi-year agreement that builds on the companies' 20-year partnership. Under the agreement, Semtech will invest in securing dedicated silicon germanium capacity at Tower in support of its strong design wins and demand for AI Data Center optical interconnect components. The secured capacity spans Tower's fabs in the United States, Israel and Japan, adding supply resilience and geographic diversification to Semtech's manufacturing strategy. Building on current production, the agreement gives Semtech additional supply assurance as demand for its SiGe-based products is expected to grow across a broadening base of customer programs and end markets.
Tower Semiconductor and Semtech Expand Partnership Agreement
Tower Semiconductor (TSEM) and Semtech (SMTC) announced an expanded multi-year agreement that builds on the companies' 20-year partnership. Under the agreement, Semtech will invest in securing dedicated silicon germanium, or SiGe, capacity at Tower in support of its strong design wins and demand for AI Data Center optical interconnect components.
Tower Semiconductor and NewPhotonics Launch Laser-Integrated Optical Engines
Tower Semiconductor and NewPhotonics announced high-volume shipment of laser-integrated serviceable optical engines designed to meet the urgent and growing demand for high-bandwidth, energy-efficient optical interconnects in artificial intelligence infrastructure. The PIC optical engine chips support OEM solutions ranging from FRO/LRO/LPO and Extra-Dense Packaged Optics pluggable transceiver modules and Near-Packaged Optics socket pluggable applications. Shipping volume production PICs today support data rates from 800G to 1.6T, with future volume manufacturing planned at 6.4T NPO solutions suitable for scale-out and scale-up architectures. The collaboration leverages the high-volume PH18DA silicon photonics technology platform featuring heterogeneously integrated InP components enabling monolithic integration of lasers, semiconductor optical amplifiers, modulators, and photodetectors on a single photonic integrated circuit. This highly integrated, optical-domain focused approach reduces complexity and manufacturing variability to supply better yield, reliability, and time-to-market with a leading-edge photonic device.
Tower Semiconductor and OpenLight Launch Photonic Design Kit
Tower Semiconductor and OpenLight, a provider of heterogeneous III-V-on-silicon photonic integration and custom Photonic Application-Specific Integrated Circuits, or PASICs, announced the availability of OpenLight's photonic Process Design Kit for Tower Semiconductor's PH18DA indium phosphide-on-silicon photonics platform in Cadence's electronic design automation tools. Developed through technical collaboration between the companies, the PDK now enables customers to design advanced photonic integrated circuits within a widely adopted IC design environment and accelerate development toward production. The PH18DA ecosystem brings together OpenLight's photonics IP, Tower's process and manufacturing expertise, and Cadence's EDA tools, enabling a streamlined path for developing advanced photonic ICs while bringing photonics design closer to established electronic IC workflows and manufacturing. Designs created using OpenLight's PDK support fabrication on Tower's PH18DA InP-on-silicon photonics platform, which enables the integration of active photonic components into a single monolithic PIC.
Company Issues Q3 2026 Revenue Guidance of $520 Million
The company said, "The Company provides revenue guidance of $520 million for the third quarter of 2026, a Company record, with an upward or downward range of 5%. Mid-range revenue guidance represents an increase of 31% year-over-year and 13% quarter-over-quarter."
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