強気
$25.65
シナリオ価格
$44.820
-2.626 (-5.86%)終値時点
Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and tests technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.
Amkor Technology Inc (AMKR) is a good buy right now due to its current price of $49.12, which is significantly below analyst price targets ranging from $65 to $90. The stock has a forward P/E ratio of 18.83, indicating potential for growth compared to its current valuation. Additionally, the company has shown strong revenue growth, with Q2 2026 revenue reported at $1.89 billion, up from $1.51 billion in Q2 2025. However, a key risk is the recent insider selling, which has increased by 2362.17%, indicating potential concerns among insiders about the company's future performance.
BofA
$70
2026-08-27
BofA
2026-08-27
目標株価
$70
B. Riley
$65
2026-07-28
B. Riley
2026-07-28
目標株価
$65
Morgan Stanley
$70
2026-07-28
Morgan Stanley
2026-07-28
目標株価
$70
UBS
$90
2026-07-24
UBS
2026-07-24
目標株価
$90
B. Riley
$75
2026-07-22
B. Riley
2026-07-22
目標株価
$75
シナリオ価格は本年の最終月次予想レンジです。確率はモデルの固定ウェイト(25 / 50 / 25)であり、保証ではありません。

Investor Sentiments on Multiple Stocks

Amkor Technology Shareholders Can Boost Income via Options

Amkor Technology Expands Arizona Manufacturing Site

Amkor Technology Expands Arizona Packaging Capacity

Amkor Technology Expands Advanced Packaging Capacity in Arizona
Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and tests technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments. It operates in the Technology sector (SEMICONDUCTORS & RELATED DEVICES industry).
Amkor Technology Inc (AMKR) is a good buy right now due to its current price of $49.12, which is significantly below analyst price targets ranging from $65 to $90. The stock has a forward P/E ratio of 18.83, indicating potential for growth compared to its current valuation. Additionally, the company has shown strong revenue growth, with Q2 2026 revenue reported at $1.89 billion, up from $1.51 billion in Q2 2025. However, a key risk is the recent insider selling, which has increased by 2362.17%, indicating potential concerns among insiders about the company's future performance.
3 analysts cover AMKR: 0 rate it Buy, 2 Hold and 1 Sell. The average price target is 51.83.


FOPLP is coming. Here are the plans from major advanced packaging suppliers: · Powertech (PTI): 510 × 515 mm. Ramp-up: 2027 · $ASX: 310 × 310 mm. Ramp-up: 2027 · $TSM: 310 × 310 mm. Ramp-up: 2028 · Samsung: 415 × 510 mm. Ramp-up: 2028 · Rapidus: 600 × 600 mm. Ramp-up: 2029 · $AMKR: 650 × 650 mm. Ramp-up: 2028 · $INTC: 510/515 mm class. Ramp-up: 2029
もっと見る
$AMKR Amkor Technology announces phase 2 of its Arizona Advanced campus Amkor Technology announced phase 2 of its Arizona Advanced packaging and test campus. Driven by strong customer commitments that have surpassed the 33,000 square meters of cleanroom capacity planned for phase 1, the phase 2 expansion is expected to add 60,000 square meters and bring the campus to approximately 93,000 square meters of cleanroom space. The expansion increases the project's planned investment to approximately $12B. Designed from the outset as a multi-phase project, Amkor's Arizona campus, which includes wafer bump, probe, assembly and test capabilities, is being developed to support long-term demand for advanced semiconductor packaging and test services in the U.S. Phase 2 expands manufacturing scale, and together with phase 1 is expected to support a workforce of more than 3,500 Arizona-based employees.
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